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ST-Ericsson was formed on 3 February 2009 when STMicroelectronics and Ericsson completed the merger of Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture. On 20 August 2008, STMicroelectronics and Ericsson announced their interest to merge their wireless semiconductor businesses. STMicroelectronics to ramp up production of compasses for smartphones STMicroelectronics NV, Europe’s largest semiconductor maker, is ramping up production of miniature compasses and altimeters for smartphones as handsets increasingly turn into catch-all devices.
Q. You will be speaking on technologies and applications for image sensors and sensor fusion – can you give us some insight into what delegates will hear during your presentation?
I will begin my talk by presenting specialized CMOS image sensors, designed for global shutter HDR pixel for automotive and consumer applications, and CMOS 40 nm SPAD pixel for Time-of-Flight products and ambient light sensor devices. I will then provide an outlook on the technological advancements and new application areas, before moving on to 3D stacked technology and briefly introducing MEMS sensors and microprocessors. Finally, I will conclude with the overview of the wide range of applications which our technology and product portfolio addresses. Our broad range of sensing products and technologies puts ST at the forefront of AI and machine perception, for which collecting external data is essential.
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Q. What do you think will be the biggest challenges to the image sensors industry in the next 12-24 months? How do you think the conference agenda addresses these?
The world of sensors is driven by technology, which means it is essential to master multiple core technologies and know-hows to provide differentiated products.
The so-called RGB megapixel race is still on (now reaching 100 mega pixels!) and the requirements for picture quality have never been higher, resulting in new multi-sensor approaches in smartphones. The variety of new applications with specific requirements, such as 3D front and rear imaging in mobile phones, is an additional challenge for industry players, multi-spectral applications for industrial applications, health and well-being, and image sensors with increased dynamic range and functionality for automotive in-cabin and external monitoring. Integrating the sensing and processing technology behind these applications will be key to meet market expectations.
I believe the diversity of the participants joining this conference makes it a great place to discuss the fascinating world of image sensors.
Q. What do you think will be some of the most interesting advancements image sensors in the near future?
Image sensor technologies have been a great source of innovation in multiple markets, applications and use cases over the past decades – and I believe there are still many opportunities ahead. For the near future, I am convinced long wavelength and low-power imaging, LiDAR as well as thermal imaging are likely to see great advancements.
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Q. What are you most looking forward to about attending the Image Sensors Europe Conference?
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Of course, I look forward to discussing ST sensor technology, but also and most importantly, to meeting with experts and technologists from around the image sensing world, listening to inspiring presentations, and having fruitful exchanges with passionate and curious people.